This patch adds syscon property for specifying soc-glue core into DT binding documentation.
Currently, soc-glue core is used for changing the state of S/PDIF signal output pin to signal output state or Hi-Z state. If you don't need to use features on soc-glue described above you can ommit this property.
Signed-off-by: Katsuhiro Suzuki suzuki.katsuhiro@socionext.com --- Documentation/devicetree/bindings/sound/uniphier,aio.txt | 8 ++++++++ 1 file changed, 8 insertions(+)
diff --git a/Documentation/devicetree/bindings/sound/uniphier,aio.txt b/Documentation/devicetree/bindings/sound/uniphier,aio.txt index 65d71cf6ef0f..4ce68ed6f2f2 100644 --- a/Documentation/devicetree/bindings/sound/uniphier,aio.txt +++ b/Documentation/devicetree/bindings/sound/uniphier,aio.txt @@ -22,6 +22,12 @@ Required properties: entry in reset-names. - #sound-dai-cells: should be 1.
+Optional properties: +- socionext,syscon: a phandle, should contain soc-glue. + The soc-glue is used for changing mode of S/PDIF signal pin + to Output from Hi-Z. This property is optional if you use + I2S signal pins only. + Example: audio { compatible = "socionext,uniphier-ld20-aio"; @@ -34,4 +40,6 @@ Example: reset-names = "aio"; resets = <&sys_rst 40>; #sound-dai-cells = <1>; + + socionext,syscon = <&sg>; };